Introduction to ESD in SMT Assembly Electrostatic discharge (ESD) is a common phenomenon that can cause significant damage to electronic components during the surface mount technology (SMT) assembly process. ESD occurs when there is a sudden transfer of electrostatic charge between two objects with different electrical potentials. In the context […]

Introduction to the MT8870 The MT8870 is a DTMF receiver IC manufactured by various semiconductor companies, including Mitel, Zarlink, and others. It is designed to decode DTMF tones, which are the audible tones generated when pressing keys on a telephone keypad or other tone-generating devices. DTMF signaling is widely used […]

Introduction When troubleshooting audio equipment, a Signal Injector can be an invaluable tool to quickly identify where a problem lies in a system. A signal injector is a simple device that generates an audio test tone which can be injected at various points in an audio signal chain to trace […]

Introduction to Controlled Impedance PCB In the world of high-speed electronics, signal integrity is a crucial aspect that cannot be overlooked. As digital systems continue to push the boundaries of speed and performance, the need for reliable and efficient printed circuit boards (PCBs) becomes increasingly important. One key factor in […]

Introduction to Rotary Encoders A rotary encoder is an electro-mechanical device that converts the angular position or motion of a shaft or axle to analog or digital output signals. Rotary encoders are widely used in various applications, such as industrial controls, robotics, automotive systems, and computer peripherals, to measure rotation, […]

Introduction to ESP32 The ESP32 is a low-cost, low-power system on a chip (SoC) series with Wi-Fi & dual-mode Bluetooth capabilities. It is designed and developed by Espressif Systems, a Shanghai-based Chinese company. The ESP32 series employs a Tensilica Xtensa LX6 microprocessor in both dual-core and single-core variations and includes […]

What is a Ball Grid Array (BGA)? A Ball Grid Array (BGA) is a type of surface-mount packaging used for integrated circuits (ICs). It utilizes a grid of solder balls on the bottom side of the package to provide electrical connections between the IC and the printed circuit board (PCB). […]

What is Functional Testing? Functional testing is a quality assurance process that verifies whether a PCB Assembly performs its intended functions according to the design specifications. It involves subjecting the assembLED PCB to various tests and measurements to ensure that it operates correctly under different conditions and scenarios. Objectives of […]

Introduction to Surface Mount Devices Surface Mount Devices, commonly known as SMDs, are electronic components that are designed to be mounted directly onto the surface of a printed circuit board (PCB). Unlike through-hole components, which require leads to be inserted into holes drilled in the PCB, SMDs are soldered directly […]

Introduction to BGA-PCB Ball Grid Array (BGA) is a surface-mount packaging technology that has revolutionized the world of printed circuit board (PCB) assembly. BGA Packages offer numerous advantages over traditional through-hole and surface-mount technologies, making them a popular choice for high-density, high-performance electronic devices. In this comprehensive article, we will […]