What is a Ball Grid Array (BGA)? A Ball Grid Array (BGA) is a type of surface-mount packaging used for integrated circuits (ICs). It utilizes a grid of solder balls on the bottom side of the package to provide electrical connections between the IC and the printed circuit board (PCB). […]
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What is Functional Testing? Functional testing is a quality assurance process that verifies whether a PCB Assembly performs its intended functions according to the design specifications. It involves subjecting the assembLED PCB to various tests and measurements to ensure that it operates correctly under different conditions and scenarios. Objectives of […]
Introduction to BGA-PCB Ball Grid Array (BGA) is a surface-mount packaging technology that has revolutionized the world of printed circuit board (PCB) assembly. BGA Packages offer numerous advantages over traditional through-hole and surface-mount technologies, making them a popular choice for high-density, high-performance electronic devices. In this comprehensive article, we will […]
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Introduction to PCB Assembly PCB assembly is the process of populating a printed circuit board (PCB) with electronic components to create a functional electronic device. The PCB serves as the foundation for the electronic circuit, providing the necessary electrical connections between components. The assembly process involves several steps, including solder […]
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Introduction to Surface Mount Devices Surface Mount Devices, commonly known as SMDs, are electronic components that are designed to be mounted directly onto the surface of a printed circuit board (PCB). Unlike through-hole components, which require leads to be inserted into holes drilled in the PCB, SMDs are soldered directly […]
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Introduction to PCB Inspection Printed Circuit Board (PCB) inspection is a crucial step in the manufacturing process to ensure the quality and reliability of electronic devices. PCB inspection involves examining the board for various defects, such as short circuits, open circuits, incorrect component placement, and soldering issues. In this article, […]
Introduction to ESP32 The ESP32 is a low-cost, low-power system on a chip (SoC) series with Wi-Fi & dual-mode Bluetooth capabilities. It is designed and developed by Espressif Systems, a Shanghai-based Chinese company. The ESP32 series employs a Tensilica Xtensa LX6 microprocessor in both dual-core and single-core variations and includes […]
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Introduction to PCB materials Printed Circuit Boards (PCBs) are the backbone of modern electronics, providing a reliable and efficient means of connecting electronic components. The choice of materials used in PCB Fabrication plays a crucial role in determining the performance, durability, and cost of the final product. In this comprehensive […]
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Introduction to Via Fill in PCB Design In the world of printed circuit board (PCB) design, vias play a crucial role in connecting different layers of the board. Vias are essentially small holes drilled through the PCB that allow electrical connections to be made between different layers. There are two […]
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The Evolution of PCB Technology PCBs have come a long way since their invention in the early 20th century. The first PCBs were simple, single-sided boards with through-hole components. As electronics became more complex and miniaturized, PCBs evolved to accommodate these changes. The introduction of double-sided boards, multi-layer boards, and […]