Introduction to IPC-A-600 Standards IPC-A-600 is the industry standard for establishing acceptability requirements for printed circuit boards (PCBs). Developed by the Association Connecting Electronics Industries (IPC), this standard provides visual quality acceptability requirements and illustrations for PCBs. It covers various aspects of PCB manufacturing, including materials, workmanship, solderability, and surface […]

Introduction to ASU PCB ASU PCB, or Advanced Substrate Unicorn Printed Circuit Board, is a cutting-edge technology that has revolutionized the electronics industry in China. This innovative PCB design offers superior performance, reliability, and cost-effectiveness compared to traditional PCB technologies. In this article, we will explore the various aspects of […]

What are Blind-Buried-Vias? Blind and buried vias are two types of interconnects used in printed circuit board (PCB) design. These vias provide electrical connections between different layers of a multi-layer PCB, allowing for more complex and compact designs. Unlike through-hole vias, which span the entire thickness of the board, blind […]

Why is Pad to Pad Spacing Important? Pad-to-Pad spacing plays a crucial role in several aspects of PCB design and manufacturing: 1. Component Placement The pad-to-pad distance directly affects the placement of components on the PCB. It determines how closely components can be placed next to each other without causing […]

Introduction to I/O Optimization and 3D SoC SiP I/O optimization is a critical aspect of modern electronic system design, particularly with the increasing complexity and functionality of System-on-Chip (SoC) and System-in-Package (SiP) solutions. The demand for higher performance, lower power consumption, and smaller form factors has driven the adoption of […]

Table of Contents History of Underwriters Laboratory UL’s Mission and Purpose UL Standards and Certifications The UL Mark UL’s Testing Process UL’s Global Reach UL’s Impact on Consumer Safety UL’s Role in Sustainability UL’s Partnerships and Collaborations The Future of Underwriters Laboratory Frequently Asked Questions (FAQ) Request Flex PCB Manufacturing […]

What is Surface-mount technology (SMT)? Surface-mount technology is a method of assembling electronic components directly onto the surface of a printed circuit board. Unlike through-hole technology (THT), where component leads are inserted into holes drilled in the PCB and soldered on the opposite side, SMT components are placed and soldered […]

Introduction to Solder Paste Solder paste is a crucial component in the electronics assembly process, especially for Surface-mount technology (SMT). It is a mixture of tiny solder particles suspended in a flux medium, which helps to establish electrical and mechanical connections between electronic components and printed circuit boards (PCBs). Choosing […]

What is PCB Assembly? PCB assembly is the process of assembling electronic components onto a printed circuit board (PCB) to create a functional electronic device. The PCB is a flat board made of insulating materials, such as fiberglass or plastic, with conductive pathways etched onto its surface. These pathways, known […]

Properties of Copper Physical Properties Property Value Atomic Number 29 Atomic Mass 63.546 g/mol Density 8.96 g/cm³ Melting Point 1084.62°C Boiling Point 2562°C Specific Heat Capacity 0.385 J/(g·K) Thermal Conductivity 401 W/(m·K) Electrical Conductivity 5.96 × 10⁷ S/m Crystal Structure Face-Centered Cubic (FCC) Copper has a face-centered cubic crystal structure, […]