
Posted by
–

What is FR4? FR4 is a composite material made from woven fiberglass cloth impregnated with an epoxy resin binder. The “FR” stands for “Flame Retardant,” indicating that the material has been treated to resist catching fire and spreading flames. The “4” in FR4 refers to the specific grade of the material, which is the most…
Posted by
–

Introduction to Peelable Soldermask A peelable soldermask, also known as a temporary soldermask or removable soldermask, is a protective coating applied to printed circuit boards (PCBs) during the manufacturing process. This special type of soldermask is designed to be easily removed from specific areas of the PCB when needed, allowing for selective soldering or component…

What is temperature correction? Temperature correction is a method used to compensate for the influence of temperature variations on the measurement of a parameter. It involves adjusting the measured value of a parameter to account for the deviation caused by temperature changes. By applying temperature correction, the true value of the parameter can be determined,…
Posted by
–

Introduction to PCB Data Upload Uploading PCB (printed circuit board) data is an essential step in the PCB design and manufacturing process. PCB data contains all the necessary information required to fabricate the physical circuit board, including the copper layers, drill holes, component footprints, and more. Properly preparing and uploading your PCB data ensures that…
Posted by
–

Introduction to Copper fills Copper fills, also known as copper vias or PTHs (plated through holes), are a crucial component in printed circuit boards (PCBs). They provide electrical connections between different layers of a multi-layer PCB, enabling the flow of signals and power throughout the board. From a mechanical perspective, copper fills play a significant…
Posted by
–

Introduction to cEDM cEDM, or Collaborative Electronic Design and Manufacturing, is a groundbreaking approach that combines the power of collaborative design with the efficiency of modern manufacturing techniques. This innovative methodology is transforming the way electronics are designed and produced, enabling companies to bring their products to market faster, more cost-effectively, and with higher quality…
Posted by
–

What are Build-ups? Build-ups, in the context of construction and engineering, refer to the process of gradually increasing the complexity or size of a structure or system. This approach is commonly used in various fields, such as software development, manufacturing, and project management. The main purpose of build-ups is to ensure that the final product…
Posted by
–

What are Cross Sections? A cross section is a view of an object as if it had been sliced through to reveal its internal structure. Imagine cutting a loaf of bread in half and looking at the exposed surface – this is essentially a cross section. Cross sections can be taken along any plane, but…
Posted by
–

Introduction to PCB Basics Printed Circuit Boards (PCBs) are the backbone of modern electronics. They are used in almost every electronic device, from smartphones and computers to industrial equipment and medical devices. PCBs provide a platform for electronic components to be mounted and connected, allowing for the creation of complex circuits in a compact and…

How are HDI PCBs Manufactured? The HDI PCB manufacturing process involves building up the interconnect structure layer by layer on the surface of the board. This is known as sequential lamination or a built-up process. The typical steps are: Starting with a core PCB panel Drilling any through-holes Imaging and etching the outer circuit layers…