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ALL ABOUT FLEX PCB

Explore the archive, or start with the current flexible circuit design guide.

BGA Assembly Capabilities

Introduction to BGA Assembly Ball Grid Array (BGA) assembly is a critical process in the manufacturing of modern electronic devices. BGA packages offer numerous advantages over traditional through-hole…

All about Reflow Soldering

What is Reflow Soldering? Reflow soldering is a process in which solder paste, a mixture of tiny solder particles suspended in flux, is applied to the contact pads…

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Tell us what the circuit needs to do, how it will bend and when you need it. A complete build brief makes a quote easier to evaluate.

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Include Gerber and drill data, a fabrication drawing and stackup notes. Put related files in one ZIP. Add a BOM and placement file when assembly is required.

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